Aguirre & Associates

Advanced Packaging Consultant

News

Qualifications

SUMMARY of QUALIFICATIONS

 

Combine, business strategic, and project management skills with a 28-year track record of engineering  and manufacturing experience that enables revenue and profit growth.

Excellent analytical, organizational, and leadership skills. Seasoned, collaborative leader skilled in achieving aggressive goals and objectives. Global business operational perspective through exposure to diverse business protocols, particularly in North America and Asia Pacific with Fujitsu Microelectronics America, led sales technical support staff organization that supported a business unit with $5M to $10M annual revenue. Experienced engineer with expertise in Semiconductor design manufacturing, and testing; goal oriented with strong record of accomplishments.

 

EXPERIENCE

 

Sr. Technology Manager Fujitsu Microelectronics America                                           1995-2009

www.fujitsu.com/us/services/edevices/microelectronics/sms/packaging

Led, FMA’s Advanced Packaging Services business unit’s goals, results and P&L responsibilities.  Developed maintained business accounts in the USA and Canada of wafer bumping, Flip-Chip, low K assembly, SiP and wafer level CSP. Manage all customer related factory activities, customer audits, product specific engineering program management. Supported COT Wafer Foundry for 0.090um, 0.065um and 0.045um nodes, IP libraries and macros delivery in a Customer Engineering function using program management principals.

 

Product Engineering Manager Responsible for Packaging/Assembly for BGAs, FC-BGAs LGAs, CQFPs, BCC, FBGAs, CSPs and TAB-BGAs internal and subcontract packaging/assembly suppliers.  Worked closely with design at early stages to provide package performance evaluations, for ASIC and ASSP.  Managed customer support in areas of reliability, failure analysis and Advanced Package Technology qualifications including Level 2 reliability.

 

Senior Customer Quality Engineer Adaptec Inc.                                                        1993 -1995

Responsible for customer quality issues, for two OEM divisions and three mass storage accounts.  Duties included new product qualifications, monthly quality reports and assembly/fabrication. Conducted Quality reviews of engineering designs to ensure that Quality requirements were met DFM.

 

Engineering Consultant AGUIRRE & ASSOCIATES                                                        1991-1993

Owned and operated an engineering consulting firm. Prepared proposals and negotiated contracts executed projects and coordinated efforts with internal personnel.  Projects included installation of final test and wafer probe facilities, characterization of bump height and repairable attachment methodology for Flip Chip, implemented qualification, reliability and failure analysis systems and specified assembly processes for a major microprocessor supplier.

 

Director of Quality Standards CONTACT-NIPPON MINING & METALS                                    1988-1991

Promoted to director of Quality Assurance, Document Control and Product Engineering functions.  Implemented best quality practices in the manufacturing of etched lead-frames.

 

Technical Services Engineer/Sales Resolved technical issues and provided detailed reports of scientific investigations to customers.  Introduced high performance copper alloys to market place, which resulted in a 15% sales increase.  Found new applications for recently developed Copper lead frame technologies.

 

Senior Packaging/Assembly Development Engineer AMD                                             1985-1988

Developed and characterized a Silver glass die attach process with non-batch convection drying, multiple atmosphere firing system with simultaneous frame attach capabilities.  Developed a method to measure moisture content in leaded glasses, using MEA.  Developed a single and multiple orifice dispensing tool to deposit die attach materials in patterns. Sustained Semicustom Gate Array assembly line in the US, and offshore operations.

 

Engineering Projects Manager TECHNOLOGY GLASS DIV/DEGUSSA, INC.                          1980-1985

Transferred and combined two manufacturing facilities into a highly efficient process.  Develop  a dry air system capable of producing 10PPMV moisture content for firing low temperature glass.  Designed and installed direct emulsion screen making facility.  Developed image step size system capable of printing patterns, with straight walls.  Other responsibilities included optimization of processes and mass production operations support.

 

Process Engineer/Supervisor Reduced internal moisture content in leaded glasses for hermetic packages from 10K PPM to <2K PPM.  Formulated ultra-pure glass to ceramic B-stage sealing epoxy.  Maintained glass printing and glazing operations under statistical control.  Managed both Cerdip and Cerlid printing lines, glass making and screen making operations.  Trained and supervised technicians for a two-shift operation.

 

Printing Process Engineer/Supervisor ELECTRO ETCH CIRCUITS                            1977-1980

Automated the screen printing operations.  Responsible for Photolithography, plating resist and solder mask printing, and screen making departments. Supported plating and etching operations. 

 

 

EDUCATION

 

Materials Science, UNIVERSITY OF IDAHO  

Quality Engineering, DE ANZA COLLEGE

Principals of Electronic Packaging, University of Arizona, semester course

Fundamentals of Surface Science, short course, American Vacuum Society

Practical Integrated Circuit Fabrication, ICE

 

 

Publications:

Semicon West 2001

“New Bump Chip Carrier Family Expands the Wireless and optical Applications”

 

IMAPS 2002

“New Cost Effective and Low Profile Wafer Level CSP”

 

Known Good Die Workshop September 11, 2002

“Super High Density Packaging Technologies”