Aguirre & Associates

Advanced Packaging Consultant

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About Us

Aguirre & Associates provides engineering and consulting services to fabless semiconductor companies in the areas of COT Wafer Foundry and Advanced Packaging Technologies.

Mario Aguirre has extensive Semiconductor experience in package and assembly technologies including other aspects of the chip design and manufacturing.

During his career Mario has developed various advanced technologies for Flip-chip, Wafer Bumping, high speed packaging for networking applications, WCSP's, PoP's, SiP's, CSP's an near CSP's for RF applications as well as various lead-free materials, Built-Up substrates and low Alpha particle emission materials, and the application and reliability qualification of such technologies.